Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Ultrasonic Elliptic Vibration on Friction between Shoe and Workpiece in Ultrasonic Elliptic-Vibration Shoe Centerless Grinding
Effect of Ultrasonic Elliptic Vibration on Friction between Shoe and Workpiece in Ultrasonic Elliptic-Vibration Shoe Centerless Grinding
Effect of Ultrasonic Elliptic Vibration on Friction between Shoe and Workpiece in Ultrasonic Elliptic-Vibration Shoe Centerless Grinding
Wu, Y. (Autor:in) / Fan, Y. (Autor:in) / Tachibana, T. (Autor:in) / Kato, M. (Autor:in) / Tamaki, J. / Kuriyagawa, T. / Baron, Y. M.
01.01.2005
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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