Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The Effect of Grinding Residual Stresses on Contact Loading Strength Degradation inY-TZP with Different Microstructures
The Effect of Grinding Residual Stresses on Contact Loading Strength Degradation inY-TZP with Different Microstructures
The Effect of Grinding Residual Stresses on Contact Loading Strength Degradation inY-TZP with Different Microstructures
Juy, A. (Autor:in) / Anglada, M. (Autor:in)
MATERIALS SCIENCE FORUM ; 492/493 ; 47-52
01.01.2005
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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