Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of strain path change on recrystallisation in copper
Effect of strain path change on recrystallisation in copper
Effect of strain path change on recrystallisation in copper
McDonald, D. T. (Autor:in) / Bate, P. S. (Autor:in) / Hutchinson, W. B. (Autor:in)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 21 ; 693-700
01.01.2005
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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