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Tensile creep behaviour of coarse grained copper foils at high homologous temperatures and low stresses
Tensile creep behaviour of coarse grained copper foils at high homologous temperatures and low stresses
Tensile creep behaviour of coarse grained copper foils at high homologous temperatures and low stresses
Srivastava, V. (Autor:in) / McNee, K. R. (Autor:in) / Jones, H. (Autor:in) / Greenwood, G. W. (Autor:in)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 21 ; 701-707
01.01.2005
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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