Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Simulation of the Hall-Petch effect in ultra-fine grained copper
Simulation of the Hall-Petch effect in ultra-fine grained copper
Simulation of the Hall-Petch effect in ultra-fine grained copper
Lefebvre, S. (Autor:in) / Devincre, B. (Autor:in) / Hoc, T. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 400-401 ; 150-153
01.01.2005
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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