Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Latent Hardening in Copper and Copper Alloys
Latent Hardening in Copper and Copper Alloys
Latent Hardening in Copper and Copper Alloys
Boyle, K. P. (Autor:in)
MATERIALS SCIENCE FORUM ; 495/497 ; 1043-1048
01.01.2005
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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