Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE
Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE
Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE
Etter, A. L. (Autor:in) / Solas, D. (Autor:in) / Baudin, T. (Autor:in) / Penelle, R. (Autor:in)
MATERIALS SCIENCE FORUM ; 495/497 ; 845-850
01.01.2005
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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