Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution
Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution
Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution
Mohanty, U. S. (Autor:in) / Lin, K. L. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 406 ; 34-42
01.01.2005
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution
British Library Online Contents | 2014
|Corrosion mechanism of Zn-30Sn high-temperature, lead-free solder in neutral NaCl solution
British Library Online Contents | 2018
|Corrosion mechanism of Zn-30Sn high-temperature, lead-free solder in neutral NaCl solution
British Library Online Contents | 2018
|Corrosion characterization of tin-lead and lead free solders in 3.5wt.% NaCl solution
British Library Online Contents | 2008
|British Library Online Contents | 2006
|