Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Packing on Void Morphology in Resin Transfer Molded E-Glass/Epoxy Composites
Effect of Packing on Void Morphology in Resin Transfer Molded E-Glass/Epoxy Composites
Effect of Packing on Void Morphology in Resin Transfer Molded E-Glass/Epoxy Composites
Hamidi, Y. K. (Autor:in) / Aktas, L. (Autor:in) / Altan, M. C. (Autor:in)
POLYMER COMPOSITES ; 26 ; 614-627
01.01.2005
14 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.192
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