Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating: Fid-Bau Portal

Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating

Nakamura, K. / Shohji, I. / Goto, H. / Ookubo, T.

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Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating

Nakamura, K. / Shohji, I. / Goto, H. / Ookubo, T.

Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating

Nakamura, K. / Shohji, I. / Goto, H. / Ookubo, T.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Ähnliche Titel

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Titel:

Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating

Beteiligte:

Nakamura, K. (Autor:in) / Shohji, I. (Autor:in) / Goto, H. (Autor:in) / Ookubo, T. (Autor:in)

Erschienen in:

MATERIALS TRANSACTIONS ; 46 ; 2730-2736

Erscheinungsdatum:

01.01.2005

Format / Umfang:

7 pages

ISSN:

1345-9678

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Shohji, I. / Goto, H. / Nakamura, K. et al. | British Library Online Contents | 2005

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