Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The Research on New Grinding Head Used for Tool's Radius Offset of Spatial Conical Enveloping Surface Grinding
The Research on New Grinding Head Used for Tool's Radius Offset of Spatial Conical Enveloping Surface Grinding
The Research on New Grinding Head Used for Tool's Radius Offset of Spatial Conical Enveloping Surface Grinding
Zhang, Y. T. (Autor:in) / Hu, Z. Q. (Autor:in) / Kang, K. J. (Autor:in) / Li, Y. K. (Autor:in)
KEY ENGINEERING MATERIALS ; 304/305 ; 512-515
01.01.2006
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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