Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Analysis of Residual Stress in Thin Wall Injection Molding
Analysis of Residual Stress in Thin Wall Injection Molding
Analysis of Residual Stress in Thin Wall Injection Molding
Lee, H. K. (Autor:in) / Huang, J. C. (Autor:in) / Yang, G. E. (Autor:in) / Kim, H. G. (Autor:in) / Putra, I. S. / Suharto, D.
01.01.2006
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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