Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Adhesion strength of Ni film on Ti substrate characterized by three-point bend test, peel test and theoretic calculation
Adhesion strength of Ni film on Ti substrate characterized by three-point bend test, peel test and theoretic calculation
Adhesion strength of Ni film on Ti substrate characterized by three-point bend test, peel test and theoretic calculation
Ren, F. Z. (Autor:in) / Liu, P. (Autor:in) / Jia, S. G. (Autor:in) / Tian, B. H. (Autor:in) / Su, J. H. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 419 ; 233-237
01.01.2006
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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