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Through Thickness Microstructural Gradients in 7475 and 2022 Creep - Ageformed Bend Coupons
Through Thickness Microstructural Gradients in 7475 and 2022 Creep - Ageformed Bend Coupons
Through Thickness Microstructural Gradients in 7475 and 2022 Creep - Ageformed Bend Coupons
Bakavos, D. (Autor:in) / Prangnell, P. B. (Autor:in) / Bes, B. (Autor:in) / Eberl, F. (Autor:in) / Gardiner, S. (Autor:in)
MATERIALS SCIENCE FORUM ; 519/521 ; 407-412
01.01.2006
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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