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Copper Leaching Behavior from Waste Printed Circuit Board in Ammoniacal Alkaline Solution
Copper Leaching Behavior from Waste Printed Circuit Board in Ammoniacal Alkaline Solution
Copper Leaching Behavior from Waste Printed Circuit Board in Ammoniacal Alkaline Solution
Koyama, K. (Autor:in) / Tanaka, M. (Autor:in) / Lee, J.-c. (Autor:in)
MATERIALS TRANSACTIONS ; 47 ; 1788-1792
01.01.2006
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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