Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Out-of-Plane Micro-ESPI System for Measurement of Mechanical Properties of Film Materials
Out-of-Plane Micro-ESPI System for Measurement of Mechanical Properties of Film Materials
Out-of-Plane Micro-ESPI System for Measurement of Mechanical Properties of Film Materials
Kim, D. I. (Autor:in) / Huh, Y. H. (Autor:in) / Kee, C. D. (Autor:in) / Lee, S.-S. / Lee, J. H. / Park, I. K. / Song, S.-J. / Choi, M. Y.
01.01.2006
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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