Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal Stress Intensity Factors for a Normal Crack in a Piezoelectric Material Strip
Ueda, S. (Autor:in)
JOURNAL OF THERMAL STRESSES ; 29 ; 1107-1125
01.01.2006
19 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1121
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