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The Measurement of Residual Deformation in PBGA Package after Reflow Process Using A Newly Developed Laser Profiler
The Measurement of Residual Deformation in PBGA Package after Reflow Process Using A Newly Developed Laser Profiler
The Measurement of Residual Deformation in PBGA Package after Reflow Process Using A Newly Developed Laser Profiler
Kim, I. H. (Autor:in) / Yoon, J. Y. (Autor:in) / Lee, S. B. (Autor:in) / Lee, S.-B. / Kim, Y.-J.
01.01.2006
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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