Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Rectangular Microlens Array Having High Sag for Multi Chip LED Packaging
Rectangular Microlens Array Having High Sag for Multi Chip LED Packaging
Rectangular Microlens Array Having High Sag for Multi Chip LED Packaging
Jeung, W. K. (Autor:in) / Lim, C. H. (Autor:in) / Kim, T. H. (Autor:in) / Choi, S. M. (Autor:in) / Lee, S.-B. / Kim, Y.-J.
Experimental Mechanics in Nano and Biotechnology ; 1491-1494
KEY ENGINEERING MATERIALS ; 326/328
01.01.2006
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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