Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Modeling transients in the mechanical response of copper due to strain path changes
Modeling transients in the mechanical response of copper due to strain path changes
Modeling transients in the mechanical response of copper due to strain path changes
Beyerlein, I. J. (Autor:in) / Tome, C. N. (Autor:in)
INTERNATIONAL JOURNAL OF PLASTICITY ; 23 ; 640-664
01.01.2007
25 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11233
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