Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Fluxless Sn-Ag bonding in vacuum using electroplated layers
Fluxless Sn-Ag bonding in vacuum using electroplated layers
Fluxless Sn-Ag bonding in vacuum using electroplated layers
Kim, J. (Autor:in) / Lee, C. C. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 448 ; 345-350
01.01.2007
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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