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Interfacial Fracture Toughness for Film on Substrate Determined by Indentation Method
Interfacial Fracture Toughness for Film on Substrate Determined by Indentation Method
Interfacial Fracture Toughness for Film on Substrate Determined by Indentation Method
Lee, S. H. (Autor:in) / Kim, J. W. (Autor:in) / Kim, S. N. (Autor:in) / Cho, S. B. (Autor:in) / Yun, J. D. (Autor:in) / Nam, S. W. / Chang, Y. W. / Lee, S. B. / Kim, N. J.
01.01.2007
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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