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An electromechanical impedance model of a piezoceramic transducer-structure in the presence of thick adhesive bonding

Madhav, A. V. G. / Soh, C. K.

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An electromechanical impedance model of a piezoceramic transducer-structure in the presence of thick adhesive bonding

Madhav, A. V. G. / Soh, C. K.

An electromechanical impedance model of a piezoceramic transducer-structure in the presence of thick adhesive bonding

Madhav, A. V. G. / Soh, C. K.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

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Titel:

An electromechanical impedance model of a piezoceramic transducer-structure in the presence of thick adhesive bonding

Beteiligte:

Madhav, A. V. G. (Autor:in) / Soh, C. K. (Autor:in)

Erschienen in:

SMART MATERIALS AND STRUCTURES ; 16 ; 673-686

Erscheinungsdatum:

01.01.2007

Format / Umfang:

14 pages

ISSN:

0964-1726

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 530

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