Effects of electric current pulse on stability of solid/liquid interface of Al-4.5wt.% Cu alloy during directional solidification: Fid-Bau Portal

Effects of electric current pulse on stability of solid/liquid interface of Al-4.5wt.% Cu alloy during directional solidification

Liao, X. / Zhai, Q. / Song, C. / Chen, W. / Gong, Y.

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Effects of electric current pulse on stability of solid/liquid interface of Al-4.5wt.% Cu alloy during directional solidification

Liao, X. / Zhai, Q. / Song, C. / Chen, W. / Gong, Y.

Effects of electric current pulse on stability of solid/liquid interface of Al-4.5wt.% Cu alloy during directional solidification

Liao, X. / Zhai, Q. / Song, C. / Chen, W. / Gong, Y.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Ähnliche Titel

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Titel:

Effects of electric current pulse on stability of solid/liquid interface of Al-4.5wt.% Cu alloy during directional solidification

Beteiligte:

Liao, X. (Autor:in) / Zhai, Q. (Autor:in) / Song, C. (Autor:in) / Chen, W. (Autor:in) / Gong, Y. (Autor:in)

Erschienen in:

MATERIALS SCIENCE AND ENGINEERING A ; 466 ; 56-60

Erscheinungsdatum:

01.01.2007

Format / Umfang:

5 pages

ISSN:

0921-5093

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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Wen, H. / Zhou, Q. / Peng, L. et al. | British Library Online Contents | 1998

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