Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Morphology, Thermal Stability, and Solderability of Electroless Nickel-Phosphorus Plating Layer
Morphology, Thermal Stability, and Solderability of Electroless Nickel-Phosphorus Plating Layer
Morphology, Thermal Stability, and Solderability of Electroless Nickel-Phosphorus Plating Layer
Yoon, J.-W. (Autor:in) / Chun, H.-S. (Autor:in) / Kang, H.-B. (Autor:in) / Park, M.-H. (Autor:in) / Yang, C.-W. (Autor:in) / Lee, H.-J. (Autor:in) / Jung, S.-B. (Autor:in)
SURFACE REVIEW AND LETTERS ; 14 ; 827-832
01.01.2007
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
530.417
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