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Enhancement of through-thickness thermal conductivity in adhesively bonded joints using aligned carbon nanotubes
Enhancement of through-thickness thermal conductivity in adhesively bonded joints using aligned carbon nanotubes
Enhancement of through-thickness thermal conductivity in adhesively bonded joints using aligned carbon nanotubes
Sihn, S. (Autor:in) / Ganguli, S. (Autor:in) / Roy, A. K. (Autor:in) / Qu, L. (Autor:in) / Dai, L. (Autor:in)
COMPOSITES SCIENCE AND TECHNOLOGY ; 68 ; 658-665
01.01.2008
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
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