Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Surface finishes of rolled copper foil for flexible printed circuit board
Surface finishes of rolled copper foil for flexible printed circuit board
Surface finishes of rolled copper foil for flexible printed circuit board
Lee, C. Y. (Autor:in) / Moon, W. C. (Autor:in) / Jung, S. B. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 483/484 ; 723-726
01.01.2008
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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