Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
On the mechanics of surface and side-wall chipping from line-wedge indentation
On the mechanics of surface and side-wall chipping from line-wedge indentation
On the mechanics of surface and side-wall chipping from line-wedge indentation
Chai, H. (Autor:in) / Ravichandran, G. (Autor:in)
INTERNATIONAL JOURNAL OF FRACTURE ; 148 ; 221-231
01.01.2007
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1126
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