Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Investigation of material properties of thin copper films through finite element modelling of microindentation test
Investigation of material properties of thin copper films through finite element modelling of microindentation test
Investigation of material properties of thin copper films through finite element modelling of microindentation test
Iankov, R. (Autor:in) / Cherneva, S. (Autor:in) / Stoychev, D. (Autor:in)
APPLIED SURFACE SCIENCE ; 254 ; 5460-5469
01.01.2008
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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