Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Photoelastic Investigation of Slippage in Shrink-Fit Assemblies
Photoelastic Investigation of Slippage in Shrink-Fit Assemblies
Photoelastic Investigation of Slippage in Shrink-Fit Assemblies
Jones, I. A. (Autor:in) / Truman, C. E. (Autor:in) / Booker, J. D. (Autor:in)
EXPERIMENTAL MECHANICS ; 48 ; 621-633
01.01.2008
13 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1
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