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Crack Spacing and the Flow Stress in NiTi Thin Films Deposited on Cu Substrate
Crack Spacing and the Flow Stress in NiTi Thin Films Deposited on Cu Substrate
Crack Spacing and the Flow Stress in NiTi Thin Films Deposited on Cu Substrate
Li, Y.H. (Autor:in) / Meng, F.L. (Autor:in) / Liu, C.S. (Autor:in) / Wang, Y.M. (Autor:in)
KEY ENGINEERING MATERIALS ; 385/387 ; 89-92
01.01.2008
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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