Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites: Fid-Bau Portal

Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

Zheng, Y. / Shen, Z. / Cai, C. / Ma, S. / Xing, Y.

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Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

Zheng, Y. / Shen, Z. / Cai, C. / Ma, S. / Xing, Y.

Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

Zheng, Y. / Shen, Z. / Cai, C. / Ma, S. / Xing, Y.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Ähnliche Titel

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Titel:

Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

Beteiligte:

Zheng, Y. (Autor:in) / Shen, Z. (Autor:in) / Cai, C. (Autor:in) / Ma, S. (Autor:in) / Xing, Y. (Autor:in)

Erschienen in:

MATERIALS AND DESIGN -REIGATE- ; 30 ; 958-963

Erscheinungsdatum:

01.01.2009

Format / Umfang:

6 pages

ISSN:

0264-1275

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.0042

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