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Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles
Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles
Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles
Morita, T. ( Autor:in ) / Yasuda, Y. ( Autor:in ) / Ide, E. ( Autor:in ) / Akada, Y. ( Autor:in ) / Hirose, A. ( Autor:in )
MATERIALS TRANSACTIONS ; 49 ; 2875-2880
01.01.2008
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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