Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Relaxation mechanisms at grain boundaries for ambient-temperature creep of h.c.p. metals
Relaxation mechanisms at grain boundaries for ambient-temperature creep of h.c.p. metals
Relaxation mechanisms at grain boundaries for ambient-temperature creep of h.c.p. metals
Matsunaga, T. (Autor:in) / Takahashi, K. (Autor:in) / Kameyama, T. (Autor:in) / Sato, E. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 510/511 ; 356-358
01.01.2009
3 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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