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Grain-boundary sliding in a TiAl alloy with fine-grained duplex microstructure during 750degreeC creep
Grain-boundary sliding in a TiAl alloy with fine-grained duplex microstructure during 750degreeC creep
Grain-boundary sliding in a TiAl alloy with fine-grained duplex microstructure during 750degreeC creep
Peter, D. (Autor:in) / Viswanathan, G. B. (Autor:in) / Wagner, M. F. (Autor:in) / Eggeler, G. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 510/511 ; 359-363
01.01.2009
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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