Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Mode I Strain Energy Release Rate of Z-pin Reinforced CMC Laminate
Mode I Strain Energy Release Rate of Z-pin Reinforced CMC Laminate
Mode I Strain Energy Release Rate of Z-pin Reinforced CMC Laminate
Liu, W. (Autor:in) / Jiao, G.-q. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -HANGZHOU- ; 27 ; 381-384
01.01.2009
4 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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