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Study on the Dynamic Characteristics of Ultrahigh Speed Grinding Spindle Based on Squeeze Film Damping Technology
Study on the Dynamic Characteristics of Ultrahigh Speed Grinding Spindle Based on Squeeze Film Damping Technology
Study on the Dynamic Characteristics of Ultrahigh Speed Grinding Spindle Based on Squeeze Film Damping Technology
Yu, T.B. (Autor:in) / Gong, Y.D. (Autor:in) / Li, H. (Autor:in) / Wang, W.S. (Autor:in) / Zhao, B. / Xu, X. / Cai, G. / Kang, R.
01.01.2009
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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