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Analysis of Stress Intensity Factor for Interfacial Crack in Bonded Dissimilar Plate under Bending
Analysis of Stress Intensity Factor for Interfacial Crack in Bonded Dissimilar Plate under Bending
Analysis of Stress Intensity Factor for Interfacial Crack in Bonded Dissimilar Plate under Bending
Kakuno, H. (Autor:in) / Oda, K. (Autor:in) / Morisaki, T. (Autor:in) / Aliabadi, M.H. / Abela, S. / Baragetti, S. / Guagliano, M. / Lee, H.-S.
01.01.2010
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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