Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
On the residual stress field induced by a scratching round abrasive grain
On the residual stress field induced by a scratching round abrasive grain
On the residual stress field induced by a scratching round abrasive grain
Kermouche, G. (Autor:in) / Rech, J. (Autor:in) / Hamdi, H. (Autor:in) / Bergheau, J. M. (Autor:in)
WEAR -LAUSANNE- ; 269 ; 86-92
01.01.2010
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11292
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