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Bond strength evaluation of roll bonded bi-layer copper alloy strips in different rolling conditions
Bond strength evaluation of roll bonded bi-layer copper alloy strips in different rolling conditions
Bond strength evaluation of roll bonded bi-layer copper alloy strips in different rolling conditions
Hosseini, S. A. (Autor:in) / Hosseini, M. (Autor:in) / Danesh Manesh, H. (Autor:in)
MATERIALS AND DESIGN -REIGATE- ; 32 ; 76-81
01.01.2011
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.0042
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