Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives: Fid-Bau Portal

Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

Nishikawa, H. / Mikami, S. / Miyake, K. / Aoki, A. / Takemoto, T.

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Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

Nishikawa, H. / Mikami, S. / Miyake, K. / Aoki, A. / Takemoto, T.

Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

Nishikawa, H. / Mikami, S. / Miyake, K. / Aoki, A. / Takemoto, T.

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Titel:

Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

Beteiligte:

Nishikawa, H. (Autor:in) / Mikami, S. (Autor:in) / Miyake, K. (Autor:in) / Aoki, A. (Autor:in) / Takemoto, T. (Autor:in)

Erschienen in:

MATERIALS TRANSACTIONS ; 51 ; 1785-1789

Erscheinungsdatum:

01.01.2010

Format / Umfang:

5 pages

ISSN:

1345-9678

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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