Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Finite Element Analysis of Creep and Thermal Stress for Shape Memory Alloy Joint
Finite Element Analysis of Creep and Thermal Stress for Shape Memory Alloy Joint
Finite Element Analysis of Creep and Thermal Stress for Shape Memory Alloy Joint
Zhou, X.F. (Autor:in) / Zhi, Y.H. (Autor:in) / Gou, B.W. (Autor:in) / Saimoto, A. / Aliabadi, M.H.
01.01.2011
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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