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Hygroscopic and thermal micro deformations of plastic substrates for flexible electronics using digital image correlation
Hygroscopic and thermal micro deformations of plastic substrates for flexible electronics using digital image correlation
Hygroscopic and thermal micro deformations of plastic substrates for flexible electronics using digital image correlation
van den Berg, D. (Autor:in) / Barink, M. (Autor:in) / Giesen, P. (Autor:in) / Meinders, E. (Autor:in) / Yakimets, I. (Autor:in)
POLYMER TESTING -LONDON- ; 30 ; 188-194
01.01.2011
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.192
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