Numerical Modeling of Heat and Moisture Transfer during Microwave Drying of Wood above FSP (Part I: The Model): Fid-Bau Portal

Numerical Modeling of Heat and Moisture Transfer during Microwave Drying of Wood above FSP (Part I: The Model)

Yu, J.F. / Wang, X.M. / Hao, Y.N.

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Numerical Modeling of Heat and Moisture Transfer during Microwave Drying of Wood above FSP (Part I: The Model)

Yu, J.F. / Wang, X.M. / Hao, Y.N.

Numerical Modeling of Heat and Moisture Transfer during Microwave Drying of Wood above FSP (Part I: The Model)

Yu, J.F. / Wang, X.M. / Hao, Y.N.

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Titel:

Numerical Modeling of Heat and Moisture Transfer during Microwave Drying of Wood above FSP (Part I: The Model)

Beteiligte:

Yu, J.F. (Autor:in) / Wang, X.M. (Autor:in) / Hao, Y.N. (Autor:in) / Niu, J. / Zhou, G.

Erschienen in:

Physical and Numerical Simulation of Material Processing VI ; 523-528

MATERIALS SCIENCE FORUM ; 704/705

Erscheinungsdatum:

01.01.2012

Format / Umfang:

6 pages

ISSN:

0255-5476

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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