Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Tensile properties of ultrathin copper films and their temperature dependence
Tensile properties of ultrathin copper films and their temperature dependence
Tensile properties of ultrathin copper films and their temperature dependence
Guo, Q. N. (Autor:in) / Yue, X. D. (Autor:in) / Yang, S. E. (Autor:in) / Huo, Y. P. (Autor:in)
COMPUTATIONAL MATERIALS SCIENCE ; 50 ; 319-330
01.01.2010
12 pages
Aufsatz (Zeitschrift)
Englisch
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