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Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range
Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range
Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range
Tanimoto, S. (Autor:in) / Matsui, K. (Autor:in) / Zushi, Y. (Autor:in) / Sato, S. (Autor:in) / Murakami, Y. (Autor:in) / Takamori, M. (Autor:in) / Iseki, T. (Autor:in)
MATERIALS SCIENCE FORUM ; 717/720 ; 853-856
01.01.2012
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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