Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Mold Surface Roughness on the Interfacial Heat Transfer Coefficient During Solidification of Solder Alloys
Effect of Mold Surface Roughness on the Interfacial Heat Transfer Coefficient During Solidification of Solder Alloys
Effect of Mold Surface Roughness on the Interfacial Heat Transfer Coefficient During Solidification of Solder Alloys
Dias, A.C.P. (Autor:in) / Meza, E.d.S. (Autor:in) / Bertelli, F. (Autor:in) / Goulart, P.R. (Autor:in) / Cheung, N. (Autor:in) / Garcia, A. (Autor:in) / Pinto, A.M.P. / Pouzada, A.S.
01.01.2013
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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