Grain Refinement in OFHC Cu Subjected to Repetitive Upsetting Extrusion (RUE) Process

Balasundar, I. / Ravi, K.R. / Raghu, T. | British Library Online Contents | 2012

Grain-boundary structure of oxygen-free high-conductivity (OFHC) copper subjected to severe plastic deformation and annealing

Waryoba, D. R. / Kalu, P. N. / Crooks, R. | British Library Online Contents | 2008

Cyclic Stress-Strain Behavior of OFHC copper

Tuler, Floyd Robert | TIBKAT | 1962

Evolution of microstructure and texture in copper during repetitive extrusion-upsetting and subsequent annealing

Chen, Q. / Shu, D.Y. / Lin, J. et al. | British Library Online Contents | 2017

The High Strain Rate Dynamic Stress-Strain Curve for OFHC Copper

Stevenson, M. E. / Jones, S. E. / Bradt, R. C. | British Library Online Contents | 2003