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Curing Behavior of Organosilicon-Modified Phenolic-Epoxy Acrylate Resin under Curing Condition Involving Electron Beam Irradiation and Moisture Atmosphere
Curing Behavior of Organosilicon-Modified Phenolic-Epoxy Acrylate Resin under Curing Condition Involving Electron Beam Irradiation and Moisture Atmosphere
Curing Behavior of Organosilicon-Modified Phenolic-Epoxy Acrylate Resin under Curing Condition Involving Electron Beam Irradiation and Moisture Atmosphere
Li, Y. (Autor:in) / Liang, H.-b. (Autor:in) / Xiong, L. (Autor:in) / Ding, Y. (Autor:in) / Shi, W.-l. (Autor:in)
MATERIALS PROTECTION -WUHAN- ; 46 ; 21-24
01.01.2013
4 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
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