Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Exploring desiccation cracks in soils using a 2D profile laser device
Exploring desiccation cracks in soils using a 2D profile laser device
Exploring desiccation cracks in soils using a 2D profile laser device
Sanchez, M. (Autor:in) / Atique, A. (Autor:in) / Kim, S. (Autor:in) / Romero, E. (Autor:in) / Zielinski, M. (Autor:in)
ACTA GEOTECHNICA -SPRINGER VERLAG- ; 8 ; 583-596
01.01.2013
14 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
624.151
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Exploring desiccation cracks in soils using a 2D profile laser device
Springer Verlag | 2013
|Exploring desiccation cracks in soils using a 2D profile laser device
Online Contents | 2013
|Exploring desiccation cracks in soils using a 2D profile laser device
Springer Verlag | 2013
|Study of Desiccation Cracks in Soils Using A 2D Laser Scanner
British Library Conference Proceedings | 2013
|